Differential amplifier

ABSTRACT

A differential amplifier formed of MISFETs includes a differential amplification stage and a pair of cascade amplification stages which receive outputs from the differential amplification stage. In each of the cascade amplification stages, an amplifying MISFET which receives an input signal at its source has a channel conductivity of opposite type to that of the differential input MISFETs of the differential amplification stage. The differential amplifier with this construction has good frequency characteristics. Since the pair of cascade amplification stages make the currents taken from a pair of outputs from the differential amplification stage equal to each other, the operating balance of the differential amplification stage is not affected. The differential amplifier further includes a feedback circuit which detects the operating points of these cascade amplification stages by referring to the outputs of the cascade amplification stages, and generates a control voltage by comparing the operating points thus detected with a reference potential. The control voltage is fed back to the gates of the amplifying MISFETs in each cascade amplification stage. As a result, the operating point of each cascade amplification stage can be stabilized irrespective of variations in the characteristics of the MISFETs or the changes of their characteristics.

BACKGROUND OF THE INVENTION

This invention relates to a differential amplifier and more particularly to a differential amplifier suitable for use in an MIS integrated circuit constituted of MISFETs (insulated-gate fieldeffect transistors).

A differential amplifier includes a differential input stage which consists of symmetric circuits, and can eliminate the in-phase component of differential inputs. Noise that is liable to be superimposed on a power source voltage can be regarded as in-phase noise by the differential amplifier, hence a differential amplifier has the advantage that the power source noise does not influence the output of the differential amplifier. In an integrated circuit including a logic circuit together with a substantially analog circuit, the power source voltage is likely to vary according to the logic operation of the circuit. Since a differential amplifier is virtually insensitive to power source noise, it can be fabricated extremely conveniently in an integrated circuit configuration together with the logic circuit.

With a differential amplifier, however, the output fluctuates even if the differential inputs are at the same level, when there is no stabilization point determined by the circuit itself. In other words, the differential amplifier has the problem that its operating point is not stabilized.

SUMMARY OF THE INVENTION

It is therefore an object of the present invention to provide a differential amplifier in which the operating point of the circuit is stabilized.

It is another object of the present invention to provide a differential amplifier which can operate at high speed and has a stabilized operating point.

It is still another object of the present invention to provide a differential amplifier which is suitable for a complementary MIS integrated circuit configuration.

It is still another object of the present invention to provide a differential amplifier which can improve the production yield of integrated circuits.

Other objects of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings.

In accordance with one embodiment of the invention which will be described later in further detail, the amplifier is provided with a resistor circuit which receives differential outputs from a cascade stage and a MISFET which is operated by a potential of an intermediate level between differential outputs produced by this resistor circuit. Negative feedback is applied to the cascade stage by a bias current flowing through this MISFET. The operating point of the output is stabilized at the intermediate point of the power source voltage (between V_(DD) and V_(ss)) in response to the negative feedback operation.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a circuit diagram of a differential amplifier in accordance with one embodiment of the present invention;

FIG. 2 is a cross-sectional view of a complementary MIS integrated circuit; and

FIGS. 3A and 3B are circuit diagrams, each showing a reference voltage generation circuit.

DESCRIPTION OF THE PREFERRED EMBODIMENT

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 shows a differential amplifier in accordance with one embodiment of the present invention. This amplifier includes a bias circuit 1, a differential input stage 2, a cascade stage 3 and an output stage 4.

The circuit shown in the diagram is formed on a single semiconductor substrate by known complementary MOS integrated circuit techniques.

The differential input stage 2 consists of a pair of differential input MISFETs Q₁, Q₂, load MISFETs Q₃, Q₄ forming a current-mirror circuit which is interposed between the drains of MISFETs Q₁, Q₂ and a power line PL, and a constant-current MISFET Q₅ which is interposed between the common source of the input MISFETs Q₁, Q₂ and a reference potential line RL.

Although the invention is not particularly limited to this, the input MISFETs Q₁, Q₂ are shown as N-channel type, the load MISFETs Q₃, Q₄ are of the P-channel type, opposite to the conductivity type of the former, and the constant-current MISFET Q₅ is of the N-channel type.

The input MISFETs Q₁ and Q₂ are constructed to have the same dimensions and characteristics with respect to each other. Similarly, the load MISFETs Q₃ and Q₄ forming the current-mirror circuit have the same dimensions and characteristics. This arrangement minimizes the offset voltage and drift of the differential input stage 2.

In the diagram, the substrate gates of the N-channel MISFETs Q₁, Q₂, Q₇, Q₁₂ and Q₁₃ are represented by dashed lines. The substrate gates of the rest of the MISFETs are now shown in order to simplify the diagram. The substrate gates of the P-channel MISFETs, now shown, should be interpreted as being connected to the point of the circuit with the maximum potential, i.e. the power line PL. The substrate gates of the N-channel MISFETs that are not shown should be interpreted as being connected to the reference potential line RL.

FIG. 2 shows a cross-section of a CMOS integrated circuit. A relatively thick field oxide film 101 is formed by known selective oxidation techniques on the surface of an N-type monocrystalline silicon substrate 100 over the regions other than the regions which are to become active regions. A P-type well region 102a for forming the N-channel MISFETs Q₁, Q₂ and a P-type well region 102b for forming other N-channel MISFETs are formed on the surface of the substrate 100. The N-channel MISFET Q₁ consists of a gate electrode 107a consisting of a polysilicon layer formmed on the P-type well region 102a through a relatively thin gate oxide film 105, a drain region 103a consisting of an N-type silicon region which is formed on the surface of the P-type well region 102a by utilizing the gate electrode 107a as a kind of impurity doping mask, and a common source region 103b. The N-channel MISFET Q₂ has the same construction as MISFET Q₁. These MISFETs Q₁ and Q₂ are formed on the well region 102a close to each other as shown in the figure. If the fabrication conditions of the integrated circuit vary somewhat, therefore, the characteristics of these MIFETs vary in a similar way. In other words, any relative variation in the characteristics of the MISFETs Q₁ and Q₂ is small. Since these MISFETs Q₁ and Q₂ are formed close to each other, they operate at substantially the same operating temperatures. Hence, they exhibit the same characteristics irrespective of their individual temperature characteristics.

The P-type well region 102a acting as the common substrate gate for MISFETs Q₁, Q₂ is connected to the common source region 103b through a contact region 104a and conductor layers 108 and l4, each of which could be a vacuum-evaporated aluminum layer for example. The gate electrodes 107a and 107b are connected to terminals IN₁ and IN₂ through conductor layers l₁ and l₂, which could be vacuum-evaporated aluminum layers for example. The terminals IN₁ and IN₂ could be bonding pads formed on the surface of the substrate 100, and are not shown in the figure.

The P-type well region 102b forms a common substrate gate for a plurality of N-channel MISFETs that are formed on the surface of the P-type well region 102b and are not shown in the figure. The well region 102b is connected to the reference potential line RL (see FIG. 1).

The P-channel MISFETs Q₃, Q₄, etc., are formed on the surface of the substrate 100, which forms the common substrate gate for the P-channel MISFETs and is connected to the power line PL.

Since the potential of the substrate gates of the differential input MISFETs Q₁ and Q₂ are made equal to their respective source potentials, they are not affected much by changes in their characteristics due to known substrate effects.

Returning to FIG. 1, the bias circuit 1 consists of a constant-current MISFET Q₆ which forms a current-mirror circuit with the constant-current MISFET Q₅ of the differential input stage 2 and MISFETs Q₁₄, Q₁₅, and which supplies a bias to these MISFETs, and load MISFETs Q₇, Q₈, Q₉ connected in series between the drain of the constant-current MISFET Q₆ and the power source voltage V_(DD).

The MISFETs Q₆ to Q₉ that form the bias circuit 1 are constructed so as to have an appropriate conductance ratio with respect to one another. A constant voltage obtained by dividing the voltage across the power terminals V_(DD) and V_(ss) by this conductance ratio is applied to MISFET Q₅ of the differential input stage 2. As a result, MISFET Q₅ is made to operate as a constant-current source.

The cascade stage 3 consists of a pair of P-channel MISFETs Q₁₀, Q₁₁ forming a gate-ground circuit, MISFETs Q₁₂, Q₁₃ connected to the drains of MISFETs Q₁₀, Q₁₁, respectively, and constant-current MISFETs Q₁₄, Q₁₅ that are connected in series between MISFETs Q₁₂, Q₁₃ and the power source voltage V_(DD).

The MISFETs Q₁₄ and Q₁₅ form the current-mirror circuit together with the constant-current MISFET Q₆ of the bias circuit 1, as described above. Since MISFETs Q₁₄ and Q₁₅ are made to operate as a constant-current source in this manner, the cascade stage 3 is biased by the bias circuit 1.

According to this construction, the differential output taken from nodes a₁ and a₂ on the drain side of the differential input MISFETs Q₁ and Q₂ forming the input stage 2 is input to the sources of MISFETs Q₁₀ and Q₁₁. According to the circuit shown in the figure, moreover, MISFETs Q₁₀ and Q₁₁ substantially form a gateground circuit so that the adverse influence of the mirror capacity upon the circuit operation, that would occur if it were a gate input, can be eliminated and hence the cascade stage 3 can operate at high speed.

The MISFETs Q₁₀, Q₁₂ and Q₁₄ on one side of the cascade stage 3 optimize the operating conditions of the input stage 2 and improve the balance of the cascade stage 3. In other words, a current which is to flow through MISFETs Q₁₀ and Q₁₁ is generated by branching off part of the current of the load MISFETs Q₃ and Q₄ of the input stage 2. If MISFETs Q₁₀, Q₁₂ and Q₁₄ were not provided, therefore, the current flowing through MISFET Q₃ will be different from the current flowing through MISFET Q₄ ; hence, the level at node a₂ would drop.

The drop of level at node a₂ can be prevented by, for example, making the mutual conductance of MISFET Q₄ greater than that of MISFET Q₃, or by making the current amplification ratio of the current-mirror circuit of Q₃ and Q₄ greater than 1. Care must be taken in this case because relative changes or variations in the characteristics of these MISFETs Q₃ and Q₄ will occur because their dimensions are different. If at least MISFET Q₁₀ is provided, the operating current of MISFET Q₃ can be balanced with that of Q₄, and their dimensions can also be balanced with each other.

If the embodiment described above, the output of the circuit consisting of MISFETs Q₁₁, Q₁₃ and Q₁₅ is used to raise the operating point of the cascade stage 3 to an appropriate level.

In the cascade stage 3 shown in the figure, MISFETs Q₁₂ and Q₁₃ are not always necessary. When these MISFETs are omitted, the constant-current MISFETs Q₁₄ and Q₁₅ constitute the drain load of the input MISFETs Q₁₀ and Q₁₁. Accordingly, output signals can be obtained from the drains of MISFETs Q₁₀ and Q₁₁ even when MISFETs Q₁₂ and Q₁₃ are not provided.

MISFETs Q₁₂ and Q₁₃ of the cascade stage 3 are provided in order to improve the bias stability. If these transistors are not provided, the voltages between the drains and sources of MISFETs Q₁₄ and Q₁₅ will increase, and the drain currents of the constant-current MISFETs Q₁₄ and Q₁₅ will therefore increase due to the well-known effective channel-length modulation effect. In contrast, the voltage between the drain and source of MISFET Q₆ in the bias circuit 1 is made to have a relatively low value in response to the voltage drop across each of MISFETs Q₉, Q₈ and Q₇. As a result, the current-mirror ratio (current amplification ratio) of MISFET Q₆ to MISFETs Q₁₄ and Q₁₅ does not correspond very well to the size ratio of MISFET Q₆ to MISFETs Q₁₄ and Q₁₅. Undesirable changes in the current-mirror ratio due to changes in the voltage level mean undesirable changes of the drain outputs of MISFETs Q₁₀ and Q₁₁.

Accordingly, this embodiment inserts MISFETs Q₁₂ and Q₁₃ between MISFETs Q₁₀ and Q₁₄ and between MISFETs Q₁₁ and Q₁₅, respectively, of the cascade stage 3.

Although the invention is not particularly limited to this, this embodiment has the conductance ratio of MISFETs Q₃, Q₁₀, Q₁₂ and Q₁₄ and the conductance ratio of MISFETs Q₄, Q₁₁, Q₁₃ and Q₁₅ agree with the conductance ratio of MISFETs Q₉, Q₈, Q₇ and Q₆ of the bias circuit 1. This stabilizes the bias point of the cascade stage 3. If these conductance ratios do not agree with one another, the bias point will change even with a slight change in the power source voltage.

Next a feedback system for the cascade stage 3 will be described.

MISFETs Q₁₆ to Q₂₁ form a feedback circuit 5. The drain voltage of MISFETs Q₁₀ and Q₁₁, that is, the potentials at output nodes b₁ and b₂ of the cascade stage 3, are applied to the two ends of a pair of N-channel MISFETs Q₁₆ and Q₁₇ connected in series. The power source voltage V_(DD) is applied to the gate terminals of MISFETs Q₁₆ and Q₁₇ so that these transistors operate as resistors with relatively high resistances. Accordingly, these transistors Q₁₆ and Q₁₇ constitute a kind of a voltage dividing resistor circuit that generates a voltage of an intermediate level between the potentials of the output nodes b₁ and b₂ of the cascade stage 3.

These MISFETs Q₁₆ and Q₁₇ have equal resistances between their sources and drains which can be as high as approximately 200 K ohms. In the normal operating state in which a level difference is generated between the output nodes b₁, b₂ of the cascade stage 3, this high resistance prevents a large current from flowing through MISFETs Q₁₆ and Q₁₇. In other words, the resistance prevents the output level (the level at node b₂) from being affected by MISFETs Q₁₆ and Q₁₇.

The gate of MISFET Q₁₈ is connected to the common source (node c) of MISFETs Q₁₆ and Q₁₇ acting as resistors. This MISFET Q₁₈ operates to apply feedback to the cascade stage 3.

A reference voltage V_(ref) is applied to the source of this MISFET Q₁₈. A load MISFET Q₁₉ is connected between the drain of MISFET Q₁₈ and the power source voltage V_(ss). The reference voltage V_(ref) has a value which is higher by the threshold voltage V_(th) (about 0.45 V) of MISFET Q₁₈ than the intermediate level (2.5 V) of the circuit, that is, the intermediate level between V_(DD) (5 V) and V_(ss) (0 V) which intermediate level will also be referred to hereinafter as the "ground level"). Accordingly, when the gate voltage of MISFET Q₁₈ or the potential at node c is higher than the ground level, MISFET Q₁₈ is turned off, and when it is lower than the ground level, MISFET Q₁₈ is turned on so that a bias current flows through MISFETs Q₁₈ and Q₁₉.

FIG. 3A shows a circuit diagram of a reference voltage generation circuit which can be used to provide the voltage V_(ref) in FIG. 1. The circuit shown in the figure consists of two N-channel MISFETs Q₃₀ and Q₃₁ connected in series between the power source terminals V_(DD) and V_(ss). The gate of each transistor Q₃₀, Q₃₁ is connected to its drain so that the transistors operate as voltage-dividing resistors. The reference voltage V_(ref) is produced from the common junction of the source of MISFET Q₃₀ and the drain of MISFET Q₃₁ by selecting appropriate conductances for each of the transistors Q₃₀ and Q₃₁. Although the invention is not particularly limited to this, the substrate gate of MISFET Q₃₀ in this embodiment is connected to its source in the same way as in MISFET Q₃₁. Accordingly, the potential difference between the source and substrate gate of MISFET Q₃₀ is kept at zero irrespective of the level of the reference voltage V_(ref). In other words, the conductance characteristics of MISFET Q₃₀ are not affected by the substrate effect. The conductance characteristics of MISFET Q₃₁ are not affected by the substrate effect, either. As a result, in the circuit shown in the drawing the reference voltage V_(ref) is output at the desired level irrespective of changes in the voltage between the power source terminals V_(DD) and V_(ss).

FIG. 3B is a circuit diagram of another reference voltage generation circuit which can be used to generate the voltage V_(ref) in FIG. 1. In this example, the bias voltage applied to the gate of a MISFET Q₃₅ is produced by MISFETs Q₃₂ and Q₃₃. This bias voltage has an intermediate value between that of the terminals V_(DD) and V_(ss) because MISFETs Q₃₂ and Q₃₃ have the same conductance characteristics. A MISFET Q₃₄ is connected between the source of MISFET Q₃₅ and terminal V_(DD) in order to apply a bias current to this transistor Q₃₅. The MISFETs shown in the figure are fabricated by IC fabrication techniques at the same time as the fabrication of the MISFETs of FIG. 1. Accordingly, the P-channel MISFET Q₃₅ has the same threshold voltage as that of MISFET Q₁₈ shown in FIG. 1. The reference voltage V_(ref) produced from the source of MISFET Q₃₅ is raised by the threshold voltage above the intermediate level. If this IC is operated by two positive and negative power sources and has a ground terminal, the gate of MISFET Q₃₅ in FIG. 3B may be connected to this ground terminal. The ground terminal is connected to the grounding point of the circuit if the IC is operated by the two positive and negative power sources. If the IC is operated only by positive power sources, the ground terminal is kept open. The gate voltage of MISFET Q₃₅ in this case is determined by the MISFETs Q₃₂ and Q₃₃.

Turning back to FIG. 1, MISFET Q₂₀ having the same conductivity type as the MISFET Q₁₉ is provided parallel to it. These MISFETs Q₁₉ and Q₂₀ are connected so as to form a current-mirror circuit. When the MISFET Q₁₈ is turned on and a current flows through the MISFET Q₁₉, a current proportional to the W/L ratio (W: channel width, L: channel length) of MISFET Q₁₉ flows through MISFET Q₂₀.

A MISFET Q₂₁ is connected between the drain of the MISFET Q₂₀ and the common drain of the MISFETs Q₇ and Q₈. The current that should flow through the MISFET Q₂₀ is supplied from the bias circuit 1 through the MISFET Q₂₁.

Because the MISFET Q₂₁ is designed so as to have a rather high resistance, any adverse effects of the feedback are exerted upon the bias circuit 1. The potential of the connection node d of the MISFETs Q₂₀ and Q₂₁ is applied to the gates of the MISFETs Q₁₀ through Q₁₃ of the cascade stage 3.

The operating points of nodes b₁ and b₂ are set at appropriate levels in order to provide effective feedback to the gates of the MISFETs Q₁₀ to Q₁₃ from node c, although the invention is not particularly limited to this arrangement. In other words, the operating points of nodes b₁ and b₂ are set so that the potential at node c, when the feedback loop of the MISFETs Q₁₈ to Q₂₁ is not there, drops but is greater by at least the threshold voltage of the MISFET Q₁₈ than the reference voltage V_(ref).

The operating points of nodes b₁ and b₂ can be set in the following manner. The gate width W of each transistor Q₁₂, Q₁₃ or each transistor Q₁₄ or Q₁₅ is set in advance to be greater than that of each transistor Q₃, Q₄ and Q₁₀, Q₁₁. According to this arrangement, the operating resistances of MISFETs Q₁₂ to Q₁₅ become smaller than those of MISFETs Q₃, Q₄, Q₁₀ and Q₁₁, so that the voltage at nodes b₁, b₂ can be reduced to the power source voltage V_(ss).

The output stage 4 consists of MISFETs Q₂₂ and Q₂₃ that are connected in series between the power source voltages V_(DD) and V_(ss). The potential of one (b₂) of the output nodes of the cascade stage 3 is applied to the gates of these transistors Q₂₂ and Q₂₃ which form a kind of CMOS inverter. An output voltage V_(out) is taken from a connecting node e of these MISFETs Q₂₂ and Q₂₃. Symbols c₁, c₂ and c₃ represent phase-compensating capacitors that are provided between the cascade stage 3 and a node e' of the output stage 4.

Next the operation of the above differential amplifier will be described. As an example, it is assumed that a positive input is applied to the gate terminal (input IN₁) of the input MISFET Q₁ of the differential input stage 2, and a negative input to the gate terminal (input IN₂) of the input MISFET Q₂.

The circuit is operated in this case in such a fashion that the potential at the output node a₁ of the differential input stage 2 becomes relatively negative and the potential at node a₂ becomes relatively positive. Because the MISFETs Q₁₀ and Q₁₁, to which the potentials of nodes a₁ and a₂ are applied, form a gate-ground circuit, the bias between the source and gate of the MISFET Q₁₁ becomes large in response to a high source input potential. Since the drain current of the MISFET Q₁₁ increases in response to the large bias, the drain voltage (at node b₂) becomes relatively positive. In contrast, the drain voltage (at node b₁) of the MISFET Q₁₀ becomes relatively negative in response to the relatively negative potential at node a₁.

Although the present invention is not particularly limited to this, the MISFETs Q₃ and Q₄ have very low impedances in order to make it possible to drive MISFETs Q₁₀ and Q₁₁ sufficiently by the input stage 2. For this reason, there is hardly any gain in the input stage 2, but in contrast the gain in the cascade stage 3 is extremely. For example, the gain from node a₂ to node b₂ can be as high as approximately 50 dB.

When the input IN₁ is kept at a relatively positive potential and the input IN₂ at a relatively negative potential, as described above, node b₂ is kept at a relatively positive potential. The potential of node b₂ is applied to the gates of the MISFETs Q₂₂ and Q₂₃ of the output stage. Hence, the conductance of the MISFET Q₂₂ is reduced and the conductance of MISFET Q₂₃ is increased. Accordingly, the output voltage V_(out), which is proportional to the voltage of the output node b₂ of the cascade state 3 (which is amplified by about 20 dB, for example) and has the opposite phase, is output from the output node e of the output stage 4.

When the operating points of the nodes b₁ and b₂ are kept at a relatively high potential in the circuit shown in the figure, their operating points will be as follows.

The potential at the connection node c of the MISFETs Q₁₆ and Q₁₇ connected between the output nodes b₁ and b₂ of the cascade stage 3 is set to the intermediate level between the potentials of nodes b₁ and b₂. As described previously, the source voltage of the MISFET Q₁₈ which has at its gate the potential of node c is set to the reference voltage V_(ref) which is higher than the ground level by the threshold voltage. Accordingly, if the potential of node c is at a level that is higher than the ground level of the circuit, for example, the MISFET Q₁₈ is turned off and no current flows to the MISFETs Q₁₉ and Q₂₀. In this case, therefore, there is substantially no feedback to the cascade stage 3 through the MISFETs Q₁₈ to Q₂₀.

The operating points at nodes b₁ and b₂ in this condition are determined by the conductance characteristics of the MISFETs Q₃, Q₄ and Q₁₀ to Q₁₅. However, their operating points fluctuate or change markedly in this state. For example, the relative characteristics between the MISFETs Q₃ and Q₄ and the MISFETs Q₁₀ and Q₁₁ cause variations that cannot be neglected, in accordance with variations in the fabricating conditions of the IC. The characteristics of the P-channel MISFETs Q₃, Q₄, Q₁₀ and Q₁₁ relative to those of the N-channel MISFETs Q₁₂ to Q₁₅ also cause variations that cannot be neglected. The gate-source voltage-to-drain current characteristics of MISFETs are temperature dependent, as is well known in the art. The temperature characteristics of P-channel MISFETs are liable to be different from those of the N-channel MISFETs. The temperature of the semiconductor substrate when the circuit is operating is raised by the heat generated by circuit elements such as MISFETs, and temperature gradients are formed between circuit elements generating a lot of heat and circuit elements generating less heat. In consequence, differences in operating temperatures, which cannot be neglected, occur between the MISFETs shown in the figure.

Since the cascade stage 3 is designed to have a relatively large gain, the operating points of nodes b₁ and b₂ are affected markedly by variations and changes in the characteristics of the MISFETs. The output level of the output stage 4 can change significantly in response to changes in the operating point of node b₂. As described previously, however, this embodiment is designed so that the operating points of nodes b₁ and b₂ have relatively low values when the feedback loop consisting of the MISFETs Q₁₈ to Q₂₁ is not provided. For this reason, the potential at node c turns the MISFET Q₁₈ on, and the operation of the feedback loop is made effective as will be described in more detail later. The operating points of nodes b₁ and b₂ are set at appropriate values by the operation of the feedback loop.

When the potentials at the output nodes b₁ and b₂ of the cascade stage 3 are reduced in the circuit shown in the figure, the potential at the common connection node c of the MISFETs Q₁₆ and Q₁₇ serving as resistors is also reduced in response. As the potential drops at node c, the MISFET Q₁₈ is turned on strongly and a large bias current starts to flow through MISFET Q₁₉. A bias voltage whose level is increased by the MISFET Q₁₉ is generated, and the current supplied from the bias circuit 1 to the MISFET Q₂₀ through the MISFET Q₂₁ is increased. Hence, the potential at the connection node d of the MISFETs Q₂₀ and Q₂₁ decrease and the gate potentials of the MISFETs Q₁₀ through Q₁₃ also decrease.

When the potential at node d drops, the gate-source voltage of the MISFETs Q₁₀ and Q₁₁ increase and the gate-source voltages of the MISFETs Q₁₂ and Q₁₃ decrease. The bias current supplied to each node b₁, b₂ via Q₁₀, Q₁₁ increases in response to the increase in the gate-source voltage of each of these MISFETs Q₁₀ and Q₁₁. As a result, the potentials at the output nodes b₁ and b₂ increase. In other words, negative feedback is applied to the gates of the MISFETs Q₁₀ through Q₁₃ of the cascade stage 3 by the MISFETs Q₁₆ and Q₁₇ forming the resistance circuit, and by the MISFETs Q₁₈ through Q₂₁.

As the potentials of the nodes b₁ and b₂ approach the ground level as a result of the negative feedback, the potential at node c also comes near the ground level and the conductance of the MISFET Q₁₈ decreases. Accordingly, the operating point for the in-phase signal at the output node b₂ of the cascade stage 3 is stabilized at a level which is substantially equal to the ground level.

The feedback operation described above remains effective even when the operating conditions of the input stage 2 change. When the levels of the inputs IN₁ and IN₂ of the input stage 2 are increased, the drain current of the constant-current MISFET Q₅ increases in response to the increase of these levels. Here the MISFET Q₅ is not an ideal constant-current source, the drain current of this MISFET Q₅ increases due to the effective channel-length modulation effect. The operating currents of the MISFETs Q₁ and Q₂ increase and the levels of nodes a₁ and a₂ decrease. On the other hand, when the levels of the input IN₁ and IN₂ are reduced, the levels of nodes a₁ and a₂ increase in response. The source-gate voltages of the MISFETs Q₁₀ and Q₁₁ of the cascade stage 3 change in accordance with the potential changes of nodes a₁ and a₂. However, the operating points of nodes b₁ and b₂ are kept at the desired values by the feedback operation of the MISFETs Q₁₈ through Q₂₁.

In the circuit of the embodiment described above, the cascade stage 3 alone generally cannot provide an output signal having a sufficient amplitude for most desired usages. Accordingly, the output stage 4 is added in order to amplify the output signal to the power source voltage. However, this output stage 4 need not always be provided and, in some cases, an output from the cascade stage 3 having a small amplitude can be utilized as it is for providing a signal to a circuit in the next stage.

In the embodiment shown, the substrate and source of the MISFET Q₇ forming the bias circuit 1 and those of the MISFETs Q₁₂ and Q₁₃ forming the cascade stage 3 are connected to one another in order to eliminate the back-gate effect (substrate effect) at the MISFETs Q₇, Q₁₂ and Q₁₃, and thus reduce the threshold voltage V_(th).

In the embodiment, the substrate and sources of the input MISFETs Q₁ and Q₂ forming the input stage 2 are also connected to one another so as to reduce V_(th) and the lower limit of the operating voltage of the input stage.

As described above, the present invention connects a resistor circuit to the output nodes of a cascade stage including MISFETs which receive an output from a differential input stage as their source inputs, so that the resistor circuit generates a potential at an intermediate level in accordance with the outputs of the cascade stage, the intermediate-level potential in turn actuates the MISFET Q₁₈ so as to enable the flow of a bias current to apply negative feedback to the MISFETs Q₁₀ through Q₁₃ via MISFETs Q₁₉ through Q₂₁. This circuit arrangement provides a stabilization point which is determined by the circuit itself so that the operating point of the circuit can therefore be stabilized, and so that the dynamic range of the circuit can be ensured sufficiently.

The present invention is not particularly limited to the embodiment described above. For example, the bias current supplied to the gates of the constant-current MISFETs Q₁₄ and Q₁₅ may be generated by the feedback circuit 5. In such a case, a fixed bias voltage could be applied to the gates of the MISFETs Q₁₀ and Q₁₁. Also, as noted previously, MISFETs Q₁₂ and Q₁₃ which reduce the drain potentials of the constant-current MISFETs Q₁₄ and Q₁₅ can be omitted. Further, although the intermediate voltage between V_(DD) and V_(ss) has been referred to throughout as the "ground level", and can, in fact, be at a zero voltage, the circuit can be arranged to operate at intermediate voltages other than a zero voltage.

It is to be understood that the above-described arrangements are simply illustrative of the application of the principles of this invention. Numerous other arrangements may be readily devised by those skilled in the art which embody the principles of the invention and fall within its spirit and scope. 

I claim:
 1. A differential amplifier comprising:a pair of differential input field-effect transistors with channels of a first conductivity type; a current-mirror load circuit which is comprised of first and second field-effect transistors with channesl of a second conductivity type connected between the drains of said pair of differential input field-effect transistors and a first power terminal; a third field-effect transistor with a channel of the second conductivity type receiving at its source a signal from the junction between the drain of said first field-effect transistor of said current-mirror load circuit and the drain of one of said pair of differential input field-effect transistors; a fourth field-effect transistor with a channel of the second conductivity type receiving at its source a signal from the junction between the drain of said second field-effect transistor of said current-mirror load circuit and the drain of the other of said pair of differential input field-effect transistors; a load circuit which forms a current path between the drains of said third and fourth field-effect transistors and a second power terminal; a voltage generation circuit which generates a bias voltage applied to the gates of said third and fourth field-effect transistors, and feed back means coupled between the drains of said third and fourth field-effect transistors and the gates of said third and fourth field-effect transistors, said feedback means including means for controlling the voltage level of the gate bias on said gates of said third and fourth field-effect transistors in accordance with the voltage level at said drains of said third and fourth field-effect transistors.
 2. A differential amplifier according to claim 12, wherein said feedback means includes means for dividing the drain voltages of said third and fourth field-effect transistors to provide a divided voltage signal indicative of the level of said drain voltages, means for comparing said divided voltage signal with a reference voltage, and means for adjusting the gate bias on said third and fourth field-effect transistors to stabilize the drain voltages of said third and fourth field-effect transistors to a value determined by the level of said reference voltage.
 3. A differential amplifier according to claim 2, wherein said dividing means comprises a first resistance element which receives at one of its ends the output of said third field-effect transistor and a second resistance element which receives at one of its ends the output of said fourth field-effect transistor and being connected at the other end to the other end of said first resistance element, and wherein said dividing means produces the divided voltage signal at the common junction of said first and second resistance.
 4. A differential amplifier according to claim 3, wherein each of said first and second resistance elements is comprises of a field-effect transistor.
 5. A differential amplifier according to claim 2, further comprising a constant current source connected to the sources of said pair of differential input field-effect transistors.
 6. A differential amplifier according to claim 5, wherein said constant-current source comprises a fifth field-effect transistors of said first conductivity type, and wherein said load circuit comprises a sixth field effect transistor coupled to the drain of said thrid field effect transistor and a seventh transistor coupled to the drain of the fourth field effect transistor.
 7. A differential amplifier according to claim 6, wherein the drain of said sixth field-effect transistor of load circuit is connected to the drain of said third field-effect transistor via an eighth field-effect transistor, and the drain of said seventh field-effect transistor of said load circuit is connected to the drain of said fourth field-effect transistor via a ninth field-effect transistor, whereby the levels of voltages applied to the drains and sources of said sixth and seventh field-effect transistors are reduced.
 8. A differential amplifier according to claim 7, wherein said eighth and ninth field-effect transistors have channels of said first conductivity type, and wherein said feedback means controls to voltage levels applied to the gate of each of said eighth and ninth field-effect transistors.
 9. A differential amplifier according to claim 5, further comprising an output amplifier which receives the output of said fourth field-effect transistors at its output. 